Floor

Solutions for improving impregnation performance of laminate flooring / adhesive solutions for tongue-and-groove installation. Two-layer engineered wood flooring: solutions using modified urea-formaldehyde adhesive for the base layer, modified melamine adhesive solutions. Two-layer composite hot-press E1/E0 grade adhesive solutions, cold-press E0 grade adhesive solutions. Three-layer engineered wood flooring: E1 grade/E0 grade hot-press composite adhesive solutions / E0 grade cold-press composite adhesive solutions. Solid wood flooring jointing adhesive series / finger-jointing adhesive solutions, E0 grade, D4 waterproof grade adhesive series solutions. Solid wood end-grain sealer / anti-cracking oil / equipment cleaning agent / adhesive mixing series equipment and devices. Providing integrated solutions aligned with the flooring manufacturing process series.

Integrated Flooring Adhesive Solutions, Related Processes and Recommended Adhesives:

Common Problem Analysis

Floor bends toward the back layer after hot pressing (downward bending)

Solutions

• High moisture content in the back layer, causing significant shrinkage of the back layer due to water loss during hot pressing

• Low moisture content in the face layer, insufficient tensile strength;

• Excessively high hot-press temperature or excessively long hot-press time;

Delamination after hot pressing

Solutions

• Large-area delamination: check if the press is functioning properly; check whether parameters such as temperature, time, and pressure are normal;

• Small-area delamination: check if localized moisture content is too high; low adhesive spread rate, caused by tolerances; high summer temperatures and direct blowing from a fan; whether unpressed board stacks are too close to the hot press; whether face layers have shifted and were not re-glued when repositioned;

Poor test strength results

Solutions

• General engineered wood flooring strength testing is conducted according to national standards, i.e., boiling in 70°C water for 2 hours, then drying at 60°C for 3 hours. If entire face layers or back layers peel off after boiling, the cause may be adhesive problems, followed by hot-press process issues, low adhesive spread rate or areas with missed coating—analyze specifically.

• Edge strips cracking while other areas remain intact: check whether the core board edges are too thin when cutting test specimens, whether there are hot-melt adhesive threads (lines) or paper strings, or whether adhesive paper tape is stuck between the face and core layers, or whether the back layer has excessively deep scoring marks.

• Localized delamination is mostly caused by tolerances. After analyzing the cause, re-sample and test at the factory.

Formaldehyde emission on the high side

Solutions

• Testing method

• Whether the surface is a painted finish; usually flooring testing is conducted on the painted finish surface;

• Check the hot-press process;

• Check the adhesive mixing ratio and the adhesive spread rate;