Shanghai Flooring Exhibition | Yongtenai empowers the flooring industry’s high-quality development w
From May 28 to 30, the 2024 DOMOTEX asia/CHINAFLOOR (hereinafter referred to as Shanghai Flooring Expo) was successfully held at the National Exhibition and Convention Center (Shanghai). IWG featured 2PU polyurethane, PSA pressure-sensitive adhesive, epoxy repair adhesive, low-formaldehyde ENF adhesive powder, and high-quality flooring bonding solutions, drawing significant attention. Merchants and visitors from around the world stopped by for discussions and exchanges, exploring flooring bondin



From May 28 to 30, 2024, the China International Floor Materials and Paving Technology Exhibition DOMOTEX asia/CHINAFLOOR (hereinafter referred to as: Shanghai Floor Materials Exhibition) was successfully held at the National Exhibition and Convention Center (Shanghai).
IWG Yongtenai participated in the exhibition with 2PU polyurethane, PSA pressure-sensitive adhesive, epoxy resin repair adhesive, low-formaldehyde ENF glue powder, and high-quality flooring bonding solutions, attracting much attention. Business friends from around the world stopped by to engage in discussions and explore flooring bonding technology and applications together.
Introduction to IWG Yongtenai Exhibited Products
IWG Yongtenai Epoxy Resin Repair Adhesive

IWG Yongtenai epoxy resin repair adhesive is a specialized adhesive developed by our company for repairing surface defects on wood products, commonly used in floor surface repair processes. It offers advantages such as high bonding strength, good permeability, fast curing time, and high first-pass yield. The repair adhesive is a two-component product. When in use, mix the main agent 9370A and the curing agent 9370B thoroughly in a ratio of two to one, then apply directly to the defects that need repair. Once cured, proceed to the next process step. Various color models and different viscosities of adhesive are available to suit different products and crack areas. Additionally, with our company's independently developed professional mixing equipment, batch production becomes faster.
IWG Yongtenai Low-Formaldehyde ENF Grade Glue Powder

631, M1371, PF61, H1579 formulations are our company's newly launched ENF grade modified urea-formaldehyde resin glue powder system, primarily used in the hot-pressing process for three-layer and multi-layer engineered wood floors. When in use, after stirring for 40 minutes in a certain proportion, it is ready for application and delivers excellent performance. In a 25 degrees Celsius environment, the pot life can reach 6 to 8 hours, and the assembly time can reach 40 to 50 minutes, with good pre-pressing effects and high bonding strength. It can be used for bonding various types of panels.
IWG Yongtenai 2PU Polyurethane

Polyurethane (2PU) products are the latest two-component reactive products launched by our company for the cold pressing of SPC flooring facing and backing materials. This product offers excellent wetting and coating performance, with a longer open time. In a 25℃ environment, the open time can reach 20 to 30 minutes. It has good initial tack, and improvements have been made in pressing time. Compared to ordinary products, the pressing time is significantly shortened, effectively saving about 20% of pressing time and greatly enhancing production efficiency. It can also be used with our company's professional mixing equipment for faster batch production.
IWG Yongtenai PSA Pressure-Sensitive Adhesive

PSA thermoplastic pressure-sensitive adhesive is a product meticulously developed by our company for use in hot-melt back-adhering lines for bonding acoustic underlay materials. This product produces minimal fumes when melted, with a fine, smooth adhesive that offers excellent wetting and coating properties. The coating weight per unit is 20-30 g/m², and it delivers good initial tack and material-tearing adhesion. It provides outstanding bonding results on IXPE, EVA, PE, EVA film lamination, and similar materials. The 8156H product features a high melting point and high temperature resistance, capable of passing a 80℃ oven dry-heat test for 6 hours without film shrinkage or wrinkling. The 8152W product offers a low melting point and low-temperature resistance, suitable for use in low-temperature environments from -5℃ to -15℃, and it can pass 60℃ oven dry-heat testing for 2 hours without film shrinkage or wrinkling.

IWG Yongtenai continuously enhances the comprehensive service capabilities of supply chain enterprises through the power of technology and environmental protection, consistently delivering excellent service and creating stable value for customers, injecting new momentum into the high-quality development of the flooring industry!
