PG80L

FAQ

PG80L Applicable to which application scenarios?

ChooseD3 Single Component High Frequency Splicing BoardWhat process parameters need to be provided before?

Suggest providing the adhesive material, equipment model, gluing method, wire speed, gluing temperature, opening time, temperature and humidity resistance requirements, and testing standards for technicians to determine the appropriate model and arrange for sample verification.

D3 Single Component High Frequency Splicing BoardHow to choose between hot melt adhesives and other hot melt adhesives?

A comprehensive selection should be made based on the substrate, production efficiency, temperature and humidity resistance requirements, equipment conditions, and cost targets. It is recommended to conduct sample and production line verification before mass use, and use the actual bonding effect as the final basis.