Floor

Solution Introduction

Improvement plan for impregnation performance of reinforced flooring/adhesive solution for enterprise installation, two-layer solid wood composite flooring: modified urea formaldehyde adhesive solution for substrate, modified triamine adhesive solution, two-layer composite hot pressing E1/E0 adhesive solution, cold pressing E0 adhesive solution, three-layer solid wood composite flooring: E1/E0 hot pressing composite adhesive solution/E0 cold pressing composite adhesive solution, splicing solid wood splicing adhesive series/finger joint adhesive solution, E0 and D4 waterproof adhesive series solution, solid wood end sealing agent/anti cracking oil/equipment cleaning agent/supply and adjustment adhesive series equipment device, and the manufacturing process series of composite flooring provide overall solutions.

Integrated solution for flooring adhesive, related processes, and recommended adhesives:

Common problem analysis

Bend the floor towards the back panel after hot pressing (downward bend)

Solution

• The high moisture content of the backboard leads to significant shrinkage due to water loss during the hot pressing process

• The moisture content of the surface plate is low, and the tensile strength is insufficient;

• High hot pressing temperature or long hot pressing time;

Cracking phenomenon after hot pressing

Solution

• Open the adhesive extensively and check if the press is functioning properly; Are temperature, time, pressure and other parameters normal;

• Apply a small amount of glue and check if the local moisture content is too high; The small amount of glue applied is caused by work errors; In summer, the temperature is high and is directly blown by the fan; Is the unfinished stack of boards too close to the hot press machine; Is the watch board in series, and was there no glue added when rearranging;

Poor detection intensity

Solution

• The general strength testing of solid wood composite flooring is carried out according to the national standard, which means boiling at 70 ℃ for 2 hours and drying at 60 ℃ for 3 hours. The entire surface or back panel may peel off after being boiled in water, which may be due to problems with the adhesive, followed by issues with the hot pressing process. The amount of adhesive applied may be small or there may be areas where it is missed. Specific analysis is needed.

• The edge strip is cracked, and other parts are not open. Check if the edge of the core board is too thin when cutting the test piece, if there are hot melt adhesive threads (lines) or paper ropes, or if the adhesive tape is stuck between the surface and core boards, and if the burrs and grooves on the back board are too heavy.

• Localized delamination is mostly caused by tolerances. After analyzing the reasons, you can go to the factory to take new samples for testing.

High formaldehyde emission

Solution

• Testing methods

• Whether it is a painted surface, usually the floor inspection is a painted surface inspection;

• Check the hot pressing process;

• Check the ratio of glue and the amount of glue applied;

Application Scenarios